The design of this year’s next-generation iPhone 17 will allegedly feature a smoother transition between the edges of the device and the back cover, owing to Apple’s use of a new glass-and-metal splicing material process. That’s according to the Weibo-based leaker Fixed Focus Digital.
In a post on Monday, the Chinese leaker claimed that suppliers say the iPhone 17 is adopting a ”process overhaul,” suggesting that Apple has developed new manufacturing techniques to create smoother transitions between different materials. ”The key point is that the connection area between the body’s deco [camera bump] and the back cover is a slope rather than a step,” said the leaker, based on a machine translation. The ”slope” likely refers to the smooth aesthetic transition between the camera bump and the rear – or where the protruding aluminum lens module meets the back cover.
Källa: iPhone 17 Said to Feature More Seamless Camera Bump Design
